DUBLIN, Jan. 15, 2021 /PRNewswire/ -- The "Wire Bonder Equipment - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.
The publisher brings years of research experience to the 8th edition of this report. The 184-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.
Global Wire Bonder Equipment Market to Reach $1.2 Billion by 2027
Amid the COVID-19 crisis, the global market for Wire Bonder Equipment estimated at US$1 Billion in the year 2020, is projected to reach a revised size of US$1.2 Billion by 2027, growing at a CAGR of 1.7% over the analysis period 2020-2027.
Ball Bonders, one of the segments analyzed in the report, is projected to record a 1.6% CAGR and reach US$906.2 Million by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the Stud-Bump Bonders segment is readjusted to a revised 2.1% CAGR for the next 7-year period.
The U.S. Market is Estimated at $277 Million, While China is Forecast to Grow at 3.4% CAGR
The Wire Bonder Equipment market in the U.S. is estimated at US$277 Million in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$220.2 Million by the year 2027 trailing a CAGR of 3.4% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 0.2% and 1.2% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 0.6% CAGR.
Wedge Bonders Segment to Record 1.8% CAGR
In the global Wedge Bonders segment, USA, Canada, Japan, China and Europe will drive the 1.5% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$76.8 Million in the year 2020 will reach a projected size of US$85 Million by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$153.6 Million by the year 2027, while Latin America will expand at a 2.5% CAGR through the analysis period.
Competitors identified in this market include, among others:
- DIAS Automation (HK) Ltd.
- F & K DELVOTEC Bondtechnik GmbH
- Hesse Mechatronics
- Kulicke & Soffa Pte., Ltd.
- Palomar Technologies, Inc.
- Shinkawa Electric Co., Ltd.
- Toray Engineering Co., Ltd.
Key Topics Covered:
I. INTRODUCTION, METHODOLOGY & REPORT SCOPE
II. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
- Global Competitor Market Shares
- Wire Bonder Equipment Competitor Market Share Scenario Worldwide (in %): 2019 & 2025
- Impact of COVID-19 and a Looming Global Recession
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
4. GLOBAL MARKET PERSPECTIVE
III. MARKET ANALYSIS
- Total Companies Profiled: 43
For more information about this report visit https://www.researchandmarkets.com/r/3cne3e
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Research and Markets
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