ASE Technology Holding Co Honors Outstanding Suppliers of 2024

Going above and beyond: Strengthening resilience and collaboration through innovation and ESG commitment

ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), held its ‘Best Suppliers of 2024’ awards ceremony today to recognize the critical contributions of its supply chain partners. This year, the event saw an increase in attendance with 450 representatives from over 140 suppliers supporting ASE, SPIL, and USI.

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2024 ASE Best Suppliers Award Ceremony

In 2024, ASE adopted more stringent standards in the supplier selection process, incorporating ESG (Environmental, Social, and Governance) measurements as a criteria for the first time. Following a thorough evaluation, 17 companies successfully made the mark and were duly recognized at the awards ceremony.

Driven by its ambition to achieve Net Zero 2050 and a 20 percent energy reduction by 2030, ASE is collaborating with 19 equipment suppliers to scale up energy-efficient designs. A launch ceremony was conducted today to generate awareness and encourage wider supplier participation. Additionally, to increase transparency and accountability in environmental data disclosure, certificates of appreciation were presented to 8 suppliers that participated in ASE’s carbon inventory project and successfully obtained third party verification.

Adding weight to the event’s proceedings was the invited guest of honor; Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI who remarked, “As a market leader in semiconductor packaging and testing, ASE continues to lead the industry supply chain towards advanced technologies and sustainable transformation through innovation and strategic global expansion. ASE’s efforts to strengthen collaboration with customers and supply chain partners not only enhance the resilience of the global semiconductor ecosystem but also drive the momentum of Taiwan’s semiconductor value chain. SEMI will continue to strengthen its strategic partnership with ASE to jointly promote innovation and sustainable development across the industry.”

“In addition to expressing our sincere gratitude to our supply chain partners, this event serves as a platform for ASE to communicate our strategic vision and overarching goals,” said Andrew Tang, Chief Procurement Officer, ASE Holdings. “The outlook for the semiconductor industry remains extremely dynamic and fostering a resilient supply chain is important to ASE. In order to build a highly sustainable supply chain, we will work closely with our supply partners in crucial areas such as technological innovation, supply chain resilience, ESG and forming strategic alliances. We firmly believe that continued investment in innovation and strengthening industry partnerships are essential to maintaining a long-term competitive advantage.”

“Fueled by the burgeoning demand from AI, the global semiconductor market is projected to reach USD 1 trillion within the next decade. The explosive growth of AI also marks a paradigm shift, with software innovation taking the lead over hardware development for the first time, presenting both unprecedented challenges and opportunistic transformations,” said Dr Tien Wu, Chief Operating Officer of ASE Holdings. “In parallel, the confluence of net-zero policies, digitalization and regionalization will trigger a revamp of supply chains and system architectures. The intensity of tariff policies has also brought about demand and investment uncertainties that further impact the future development of the industry. Despite these headwinds, the decade ahead represents a golden era for the semiconductor industry. Choosing the right partners and staying ahead of emerging trends will be key to gaining a competitive edge amidst geopolitical shifts. At this critical juncture, cross-industry collaboration will be instrumental in overcoming technological barriers and capitalizing on future opportunities."

Congratulations to the following award recipients* for their outstanding performance and contributions in FY2024.

• 3M TAIWAN Ltd.
• Allring Technology Co., Ltd.
• Canon Semiconductor Equipment Taiwan, Inc.
• Henkel Taiwan Ltd.
• Hwa Shu Enterprise Co., Ltd
• Leading Interconnect Semiconductor Technology Co., Ltd.
• Mitsubishi Gas Chemical Company, Inc.
• MK Electron Co., Ltd.
• Namics Corporation
• Nan Ya PCB Co., Ltd.
• Profound Material Technology Co., Ltd.
• Resonac Corporation
• Shinko Electric Industries Co., Ltd.
• Tai Hong Circuit Ind. Co., Ltd.
• Teradyne (Asia) Pte. Ltd
• Test Research, Inc.
• Tokyo Electron Limited

*The company names are listed in alphabetical order.

About ASE Technology Holding Co., Ltd.

ASE Technology Holding Co., Ltd. (ASEH) is among the leading providers of independent semiconductor manufacturing services in assembly, test, materials and system designs. As a global leader geared towards meeting the industry’s ever-growing needs for faster, smaller and higher performance chips, ASE Technology Holding develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services. For more information about ASEH, please visit www.aseglobal.com or Twitter/LinkedIn @aseglobal.

Safe Harbor Notice:

This press release contains "forward‐looking statements" within the meaning of Section 27A of the United States Securities Act of 1933, as amended, and Section 21E of the United States Securities Exchange Act of 1934, as amended. Although these forward‐looking statements, which may include statements regarding our future results of operations, financial condition or business prospects, are based on our own information and information from other sources we believe to be reliable, you should not place undue reliance on these forward‐looking statements, which apply only as of the date of this press release. The words “anticipate,” “believe,” “estimate,” “expect,” “intend,” “plan” and similar expressions, as they relate to us, are intended to identify these forward‐looking statements in this press release. These forward‐looking statements are necessarily estimates reflecting the best judgment of our senior management and our actual results of operations, financial condition or business prospects may differ materially from those expressed or implied by the forward‐looking statements for reasons including, among others, risks associated with cyclicality and market conditions in the semiconductor or electronic industry; changes in our regulatory environment, including our ability to comply with new or stricter environmental regulations and to resolve environmental liabilities; demand for the outsourced semiconductor packaging, testing and electronic manufacturing services we offer and for such outsourced services generally; the highly competitive semiconductor or manufacturing industry we are involved in; our ability to introduce new technologies in order to remain competitive; international business activities; our business strategy; our future expansion plans and capital expenditures; the strained relationship between the Republic of China and the People’s Republic of China; general economic and political conditions; the recent shift in United States trade policies; possible disruptions in commercial activities caused by natural or human‐induced disasters; fluctuations in foreign currency exchange rates; and other factors. For a discussion of these risks and other factors, please see the documents we file from time to time with the Securities and Exchange Commission, including the 2024 Annual Report on Form 20‐F filed on March 27, 2025.

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Going above and beyond: Strengthening resilience and collaboration through innovation and ESG commitment