From Extreme Heat to Orbit: StratEdge Displays RF and High-Power Solutions at iMAPS HiTEC and CMSE

~ Discover advanced semiconductor packaging for high-temperature, high-power, and high-reliability applications

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, announces that it will be showcasing its latest advancements in high-temperature packaging technology at the iMAPS HiTEC Power Packaging Conference, which takes place April 14–17 in Albuquerque, NM, and at the Components for Military & Space Electronics (CMSE) event, which runs from April 29–May 1 in Los Angeles, CA at Booth B20.

StratEdge's molded ceramic packages offer unparalleled reliability, designed to handle high-frequency chips up to 18 GHz, with over 200 standard outlines available, providing a vast array of packaging options. Many open-tooled designs are available with 50 ohm impedance high-frequency transitions, which provide convenience and ease for packaging high-performance semiconductors.

StratEdge’s packages are built for maximum reliability in power and RF applications under extreme conditions. Its molded ceramic packaging solutions offer robust thermal dissipation and high-frequency performance. According to Casey Krawiec, VP of Global Sales at StratEdge, “Our molded ceramic packages are extremely popular where devices encounter harsh environments. Testing has shown they can withstand extended exposures at over 500°C, which is why they’re selected for automotive, down-hole, jet engine, and other high-temperature applications, as well as traditional uses in space and defense.”

For more information or to arrange a meeting, contact StratEdge at info@stratedge.com or visit the website at www.stratedge.com.

Photo www.stratedge.com/high-temperature-packages.gif

Virtual Tour https://youtu.be/ewJuORN5vyQ

About StratEdge

StratEdge Corporation designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. StratEdge offers post-fired ceramic and lower-cost molded ceramic packages, specializing in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. Markets served include telecom for 5G, VSAT, broadband wireless, satellite, defense, test and measurement, automotive, clean energy, and down-hole. All packages are lead-free and most meet RoHS and WEEE standards. Our facility in Santee, California, near San Diego, is both ITAR registered and ISO 9001:2015 certified.

View source version on businesswire.com: https://www.businesswire.com/news/home/20250410618778/en/

See StratEdge at iMAPS HiTEC Power Packaging Conference, April 14–17 in Albuquerque, NM, and at the Components for Military & Space Electronics (CMSE), April 29–May 1 in Los Angeles, CA at Booth B20.