OKI Develops Ultracompact Photonic Integrated Circuit Chip Using Silicon Photonics Technology to Realize Various Optical Sensors

- A key GX technology that can be applied to various social infrastructures -

Using silicon photonics technology for semiconductor optical circuits, OKI (TOKYO: 6703) has successfully developed an ultracompact photonic integrated circuit chip with a broad range of potential applications, including optical fiber sensors, laser vibrometers, and optical biosensors. This makes it possible to achieve ultra-miniaturization and low power consumption similar to LSI (Note 1), as well as dramatically lower costs through mass production of optical sensor modules. Optical sensors are a technology that uses optical fibers and optical waveguides with low light loss to detect, process, and transmit physical phenomena such as vibration, strain, and temperature in the form of light, and are themselves a green technology that realizes sensing while saving energy. Silicon photonics technology is a technology that can broaden the scope of applications for optical sensors previously limited to localized use, and is expected to make a significant contribution to the advancement of GX (Note 2).

To address various issues faced by modern society, such as aging social infrastructure, labor shortages, environmental problems, and extending healthy lifespans, high-precision sensor technology and network technology capable of seamlessly collecting vast amounts of sensor data are required. While high-precision optical sensors that take advantage of the property of light, i.e., low energy loss, are one effective technology to realize the above, their large size and high cost have limited their applications to a few areas such as research and large-scale infrastructures.

OKI has engaged in research and development on silicon photonics technology over many years, centered on optical transceivers, with the scope of this research still currently expanding to include various optical sensors. Silicon photonics technology is a technology that integrates complex optical circuits—previously realized by wiring individual optical components with optical fibers—on a silicon substrate using semiconductor microfabrication technology. It makes use of the same manufacturing methods as LSI, which is vital for computers, enabling miniaturization, energy saving, and cost reduction through mass production. Devices that were previously large, heavy, and cumbersome can now be downsized to dimensions comparable to a smartphone or tablet, greatly expanding the scope of optical sensor applications.

In November 2023, OKI announced its technology strategy through to 2031, which is aimed at bringing the Edge Platform to reality. The Edge Platform is a technology concept to expand the value provided through edge advancement and data connection and linkage based on OKI’s core competence of “robustness,” which has supported social infrastructures. The technology strategy includes bolstering optical sensing technology across a wide range of areas, from social infrastructure monitoring to the medical field. The development of this photonic integrated circuit chip is based on this technology strategy and is the result of fully capitalizing on silicon photonics technology.

“Based on silicon photonics technology, OKI will continue to scale up photonic integrated circuits incorporating semiconductor materials other than silicon as light sources and promote photonics-electronics convergence to expand into ever more diverse fields,” commented Executive Officer Kurato Maeno, who also serves as Chief Technology Officer and Head of Technology Division. “Ultimately, OKI aims to realize a universal integrated circuit chip that enables the programmable implementation of various functions on a single chip and make the most of this as the core of its green technology.”

[Example applications]

The chip can be applied to the following uses:

• Optical fiber sensors

The miniaturization and cost reduction achieved by optical integration allow the scope of applications to expand to the monitoring and maintenance of broad-ranging social infrastructures, including bridges, tunnels, and slopes.

• Laser vibrometers

The volume ratio of approximately 1/200,000 against conventional optical circuits enables mounting on drones and robots. Utilizing wider frequency characteristics than general vibrometers contributes to more sophisticated equipment inspections and labor saving.

• Optical biosensors

Optical biosensors are capable of quickly and easily distinguishing between multiple, disparate biomaterials, contributing to the advancement of testing in the fields of biotechnology and healthcare.

• Optical transceivers

Optical transceivers enable the production of ultracompact, low-cost, high-speed transceivers for optical access networks, contributing to large-capacity data communications.

[Related links]

• Silicon Photonics Technology and Application to Optical Bio Sensor

https://www.oki.com/global/otr/2021/n237/pdf/otr-237-R15.pdf

[Terminology]

Note 1: LSI (Large-scale integration)

Device that densely integrates microscopic electronic components and wiring on a semiconductor chip such as silicon

Note 2: GX (Green transformation)

Initiatives aimed at reducing greenhouse gas emissions to achieve a sustainable society

About Oki Electric Industry Co., Ltd. (OKI)

Founded in 1881, OKI is Japan's leading information and telecommunication manufacturer. Headquartered in Tokyo, Japan, OKI provides top-quality products, technologies, and solutions to customers through its Public Solutions, Enterprise Solutions, Component Products, and Electronics Manufacturing Services businesses. Its various business divisions function synergistically to bring to market exciting new products and technologies that meet a wide range of customer needs in various sectors. Visit OKI's global website at https://www.oki.com/global/.

Notes:

- Oki Electric Industry Co., Ltd. is commonly referred to as OKI.

- Other company names and product names mentioned here are the trademarks or registered trademarks of their respective companies.

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