·
|
Net revenues of $1.71 billion and gross margin of 33.2%
|
·
|
Free cash flow of $41 million*
|
·
|
Stable cash dividend of $0.40 per common share payable in equal quarterly installments to be proposed to the 2015 Annual General Meeting of Shareholders
|
U.S. GAAP
(Million US$)
|
Q1 2015
|
Q4 2014
|
Q1 2014
|
Net Revenues
|
1,705
|
1,829
|
1,825
|
Gross Margin
|
33.2%
|
33.8%
|
32.8%
|
Operating Income (Loss), as reported
|
(19)
|
38
|
(4)
|
Net Income (Loss), attributable to parent company
|
(22)
|
43
|
(24)
|
Non-U.S. GAAP*
(Million US$)
|
Q1 2015
|
Q4 2014
|
Q1 2014
|
Operating Income (Loss) before impairment and restructuring charges
|
10
|
58
|
8
|
Operating Margin before impairment and restructuring charges
|
0.6%
|
3.2%
|
0.4%
|
Net Revenues By Product Line and Segment
(Million US$)
|
Q1 2015
|
Q4 2014
|
Q1 2014
|
Analog & MEMS (AMS)
|
255
|
266
|
304
|
Automotive (APG)
|
434
|
436
|
445
|
Industrial & Power Discrete (IPD)
|
430
|
462
|
442
|
Sense & Power and Automotive Products (SP&A)
|
1,119
|
1,164
|
1,191
|
Digital Product Group (DPG) (a)
|
207
|
259
|
282
|
Microcontroller, Memory & Secure MCU (MMS)
|
374
|
388
|
346
|
Other EPS
|
-
|
13
|
-
|
Embedded Processing Solutions (EPS)
|
581
|
660
|
628
|
Others
|
5
|
5
|
6
|
Total
|
1,705
|
1,829
|
1,825
|
Net Revenues By Market Channel (%)
|
Q1 2015
|
Q4 2014
|
Q1 2014
|
Total OEM
|
70%
|
68%
|
70%
|
Distribution
|
30%
|
32%
|
30%
|
Operating Segment
(Million US$) |
Q1 2015
Net Revenues |
Q1 2015
Operating Income (Loss) |
Q4 2014
Net Revenues |
Q4 2014
Operating Income (Loss) |
Q1 2014
Net Revenues |
Q1 2014
Operating Income (Loss) |
Sense & Power and
Automotive Products (SP&A)
|
1,119
|
72
|
1,164
|
98
|
1,191
|
101
|
Embedded Processing Solutions (EPS)
|
581
|
(64)
|
660
|
(34)
|
628
|
(82)
|
Others (a)
|
5
|
(27)
|
5
|
(26)
|
6
|
(23)
|
TOTAL
|
1,705
|
(19)
|
1,829
|
38
|
1,825
|
(4)
|
Revenues
(Million US$) |
Q1 2014
|
Q2 2014
|
Q3 2014
|
Q4 2014
|
FY 2014
|
Q1 2015
|
Digital Product Group (DPG)
|
282
|
259
|
286
|
259
|
1,086
|
207
|
Operating Income (Loss)
(Million US$)
|
Q1 2014
|
Q2 2014
|
Q3 2014
|
Q4 2014
|
FY 2014
|
Q1 2015
|
Sense & Power and
Automotive Products (SP&A)
|
101
|
125
|
111
|
98
|
435
|
72
|
Embedded Processing Solutions (EPS)
|
(82)
|
10
|
(38)
|
(34)
|
(144)
|
(64)
|
|
·
|
On March 6, ST closed the agreement with Enel Green Power to transfer its equity stake in 3Sun, a joint venture in photovoltaic panels manufacturing. ST paid €11.5 million to Enel Green Power in exchange for ST’s full release from any obligation concerning the joint venture or Enel Green Power. In addition, ST forgave its €13 million outstanding shareholder loan to the joint venture.
|
|
·
|
On March 27, ST announced the main resolutions to be submitted for adoption at the Annual General Meeting of Shareholders which will be held in Amsterdam, the Netherlands, on May 27, 2015. The main resolutions, proposed by the Supervisory Board, include:
|
|
o
|
The adoption of the Company’s Statutory Annual Accounts for the year ended December 31, 2014, prepared in accordance with International Financial Reporting Standards (IFRS);
|
|
o
|
The distribution of a cash dividend of US$0.40 per outstanding share of the Company’s common stock, to be distributed in quarterly installments of US$0.10 in each of the second, third and fourth quarters of 2015 and first quarter of 2016 to shareholders of record in the month of each quarterly payment;
|
|
o
|
The appointment of Mr. Nicolas Dufourcq as a new member of the Supervisory Board, for a three-year term expiring at the 2018 Annual General Meeting of Shareholders, in replacement of Mr. Jean d’Arthuys whose mandate will terminate as of the 2015 Annual General Meeting of Shareholders;
|
|
o
|
The reappointment of Ms. Martine Verluyten as a member of the Supervisory Board, for a three-year term expiring at the 2018 Annual General Meeting of Shareholders; and
|
|
o
|
The appointment of Ernst & Young Accountants LLP as the Company’s external auditor for the 2016-2019 financial years.
|
|
·
|
Began delivering to a European customer the latest Ultra-HDp60 quad-core Cannes and Monaco-family systems-on-chip ICs;
|
|
·
|
Captured multiple design wins globally for Liege family of set-top box processors;
|
|
·
|
Successfully demonstrated full RDK-B gateway software and DOCSIS® 3.1 real-time communication over standard COAX and device interoperability tests;
|
|
·
|
Presented operating turnkey cable modem, cable data gateway, and interactive set-top-box reference designs for transitioning DOCSIS 2.0 to DOCSIS 3.0 / C-DOCSIS in China;
|
|
·
|
Cooperated with key middleware partner iPanel on solutions for next-generation digital migration in China.
|
|
·
|
Ramped production of STM32 for latest Samsung Galaxy smartphones;
|
|
·
|
Earned important wins for STM32 in a Bluetooth-connected accessory for tablets and for two STM32s in the high-end fitness band at key global OEMs;
|
|
·
|
Extended the STM32 portfolio with ultra-low-power, high-performance STM32L4 series that, on announcement, offered the industry’s most efficient ultra-low-power microcontroller; the F0 Value line with USB and bigger Flash; and the F3 series with richer peripherals and larger memories. We now offer over 600 STM32 part numbers;
|
|
·
|
Joined with ams to launch breakthrough reference design for secure contactless NFC transactions and mobile payments in phones and wearables with tiny antennas;
|
|
·
|
Announced a new family of NFC/RFID Tags with EEPROM memory density spanning from 512bits up to 64Kbit;
|
|
·
|
Captured NFC Tag in a next-generation headset at a major audio-equipment OEM.
|
|
·
|
Ramped production of high-end touch-screen controller and barometer for latest Samsung Galaxy smartphones;
|
|
·
|
Announced adoption of control devices and micro-mirrors for Perceptual Computing initiatives at Intel and started production for several end customers;
|
|
·
|
Delivered in high volume, high-performance analog microphone to a leading smartphone brand and started production of a microphone to be used in PCs for a key American manufacturer;
|
|
·
|
Ramped production of ultra-low-power 6-axis motion sensor for a wearable application from a global brand and earned greatest share of a socket with a top Chinese brand;
|
|
·
|
Began ramping production of 6-axis ultra-low-power MEMS accelerometer and gyroscope for Samsung Galaxy smartphones;
|
|
·
|
Started production ramp for several inertial sensors in car-navigation and telematics applications in Korea, Europe and the US;
|
|
·
|
Won a socket for Bluetooth Low-Energy wireless-network processor for an industrial application from a top European manufacturer;
|
|
·
|
Introduced the world’s first sensor to provide a direct digital output of the Ultraviolet Index (UVI) for Mobile, Wearable, and IoT Applications;
|
|
·
|
Announced leadership of European Research Project to develop next-generation optical-MEMS technologies.
|
|
·
|
Won design awards for latest-generation car-radio processor with important manufacturers in Korea and Greater China;
|
|
·
|
Landed a first socket in car audio with an important Korean consumer brand supplying to a key European car maker;
|
|
·
|
Received an award for a class D car-audio amplifier with Japanese consumer supplier;
|
|
·
|
Awarded the microcontroller socket for an e-bike from a key European Tier 1;
|
|
·
|
Captured multiple mass-market awards in Europe and China for the SPC5 family of MCUs;
|
|
·
|
Earned additional sockets for a next-generation Advanced Driver Assistance System with a major European carmaker;
|
|
·
|
Designed into an existing Gen2 electronic variable orifice ASSP that moderates hydraulic fluid pressure for power steering in a large European supplier;
|
|
·
|
Earned multiple wins for several European-leaders’ Tier1 platforms with our latest-generation VIPower technology.
|
|
·
|
Ramped production of AMOLED driver for latest Samsung Galaxy smartphones;
|
|
·
|
Gained several design wins for low-voltage MOSFETs in a Power Supply for game-console applications with a global manufacturer;
|
|
·
|
Continued to gain traction with RF Integrated Passive Devices for smartphone- and IoT-related applications with leading global brands;
|
|
·
|
Revealed, with Flextronics, world’s first plug-in charger platform with zero no-load power consumption;
|
|
·
|
Secured sockets for high-voltage MOSFETs in Ultra-High-Definition-Display applications from leading manufacturer in Korea;
|
|
·
|
Captured sockets for a kit solution (power-factor controller, resonant controller, and synchronous rectification controller) for a desktop power-supply application with a Chinese multinational computer technology company;
|
|
·
|
Won designs for a DC-DC converter for powering AMOLED displays for a new tablet platform with a Korean market leader;
|
|
·
|
Landed a win for high-voltage IGBTs for an induction-heating application with a major Chinese customer;
|
|
·
|
Awarded sockets for a high-voltage resonant controller with three major TV switched-mode power-supply makers in Greater China;
|
|
·
|
Earned wins for energy-saving high-voltage power converters (VIPerPlus) from several mass-market customers in Greater China;
|
|
·
|
Captured key power-rectifier and protection-device sockets for a broad range of automotive applications with leading manufacturers.
|
STMicroelectronics N.V.
|
Consolidated Statements of Income
|
(in millions of U.S. dollars, except per share data ($))
|
Three Months Ended
|
||||||||
(Unaudited)
|
(Unaudited)
|
|||||||
March 28,
|
March 29,
|
|||||||
2015
|
2014
|
|||||||
Net sales
|
1,693 | 1,801 | ||||||
Other revenues
|
12 | 24 | ||||||
NET REVENUES
|
1,705 | 1,825 | ||||||
Cost of sales
|
(1,139 | ) | (1,226 | ) | ||||
GROSS PROFIT
|
566 | 599 | ||||||
Selling, general and administrative
|
(222 | ) | (228 | ) | ||||
Research and development
|
(369 | ) | (378 | ) | ||||
Other income and expenses, net
|
35 | 15 | ||||||
Impairment, restructuring charges and other related closure costs
|
(29 | ) | (12 | ) | ||||
Total Operating Expenses
|
(585 | ) | (603 | ) | ||||
OPERATING LOSS
|
(19 | ) | (4 | ) | ||||
Interest expense, net
|
(5 | ) | (2 | ) | ||||
Income (loss) on equity-method investments
|
4 | (8 | ) | |||||
Gain on financial instruments, net
|
- | 1 | ||||||
LOSS BEFORE INCOME TAXES
|
(20 | ) | (13 | ) | ||||
AND NONCONTROLLING INTEREST
|
||||||||
Income tax expense
|
(1 | ) | (9 | ) | ||||
NET LOSS
|
(21 | ) | (22 | ) | ||||
Net loss (income) attributable to noncontrolling interest
|
(1 | ) | (2 | ) | ||||
NET LOSS ATTRIBUTABLE TO PARENT COMPANY
|
(22 | ) | (24 | ) | ||||
EARNINGS PER SHARE (BASIC) ATTRIBUTABLE TO PARENT COMPANY STOCKHOLDERS
|
(0.03 | ) | (0.03 | ) | ||||
EARNINGS PER SHARE (DILUTED) ATTRIBUTABLE TO PARENT COMPANY STOCKHOLDERS
|
(0.03 | ) | (0.03 | ) | ||||
NUMBER OF WEIGHTED AVERAGE
|
||||||||
SHARES USED IN CALCULATING
|
||||||||
DILUTED EARNINGS PER SHARE
|
874.0 | 890.7 |
STMicroelectronics N.V.
|
||||||||||||
CONSOLIDATED BALANCE SHEETS
|
||||||||||||
As at
|
March 28,
|
December 31,
|
March 29,
|
|||||||||
In millions of U.S. dollars
|
2015
|
2014
|
2014
|
|||||||||
(Unaudited)
|
(Audited)
|
(Unaudited)
|
||||||||||
ASSETS
|
||||||||||||
Current assets:
|
||||||||||||
Cash and cash equivalents
|
1,949 | 2,017 | 1,744 | |||||||||
Short-term deposits
|
- | - | 1 | |||||||||
Marketable securities
|
338 | 334 | - | |||||||||
Trade accounts receivable, net
|
971 | 911 | 1,112 | |||||||||
Inventories
|
1,193 | 1,269 | 1,331 | |||||||||
Deferred tax assets
|
96 | 97 | 130 | |||||||||
Assets held for sale
|
34 | 33 | - | |||||||||
Other current assets
|
408 | 390 | 382 | |||||||||
Total current assets
|
4,989 | 5,051 | 4,700 | |||||||||
Goodwill
|
76 | 82 | 90 | |||||||||
Other intangible assets, net
|
184 | 193 | 228 | |||||||||
Property, plant and equipment, net
|
2,468 | 2,647 | 3,066 | |||||||||
Non-current deferred tax assets
|
385 | 386 | 222 | |||||||||
Long-term investments
|
58 | 69 | 72 | |||||||||
Other non-current assets
|
552 | 576 | 639 | |||||||||
3,723 | 3,953 | 4,317 | ||||||||||
Total assets
|
8,712 | 9,004 | 9,017 | |||||||||
LIABILITIES AND EQUITY
|
||||||||||||
Current liabilities:
|
||||||||||||
Short-term debt
|
200 | 202 | 225 | |||||||||
Trade accounts payable
|
706 | 597 | 764 | |||||||||
Other payables and accrued liabilities
|
860 | 841 | 866 | |||||||||
Dividends payable to stockholders
|
14 | 87 | 4 | |||||||||
Accrued income tax
|
38 | 39 | 51 | |||||||||
Total current liabilities
|
1,818 | 1,766 | 1,910 | |||||||||
Long-term debt
|
1,575 | 1,599 | 908 | |||||||||
Post-employment benefit obligations
|
367 | 392 | 366 | |||||||||
Long-term deferred tax liabilities
|
10 | 10 | 10 | |||||||||
Other long-term liabilities
|
181 | 182 | 148 | |||||||||
2,133 | 2,183 | 1,432 | ||||||||||
Total liabilities
|
3,951 | 3,949 | 3,342 | |||||||||
Commitment and contingencies
|
||||||||||||
Equity
|
||||||||||||
Parent company stockholders' equity
|
||||||||||||
Common stock (preferred stock: 540,000,000 shares authorized, not issued;
|
1,157 | 1,157 | 1,156 | |||||||||
common stock: Euro 1.04 nominal value, 1,200,000,000 shares authorized, 910,847,920 shares
|
||||||||||||
issued, 874,019,201 shares outstanding)
|
||||||||||||
Capital surplus
|
2,749 | 2,741 | 2,587 | |||||||||
Retained earnings
|
795 | 817 | 1,052 | |||||||||
Accumulated other comprehensive income
|
332 | 613 | 1,024 | |||||||||
Treasury stock
|
(334 | ) | (334 | ) | (212 | ) | ||||||
Total parent company stockholders' equity
|
4,699 | 4,994 | 5,607 | |||||||||
Noncontrolling interest
|
62 | 61 | 68 | |||||||||
Total equity
|
4,761 | 5,055 | 5,675 | |||||||||
Total liabilities and equity
|
8,712 | 9,004 | 9,017 |
STMicroelectronics N.V.
|
|||
SELECTED CASH FLOW DATA
|
|||
Cash Flow Data (in US$ millions)
|
Q1 2015
|
Q4 2014
|
Q1 2014
|
Net Cash from operating activities
|
149
|
311
|
53
|
Net Cash used in investing activities
|
(108)
|
(103)
|
(39)
|
Net Cash used in financing activities
|
(102)
|
(317)
|
(105)
|
Net Cash decrease
|
(68)
|
(113)
|
(92)
|
Selected Cash Flow Data (in US$ millions)
|
Q1 2015
|
Q4 2014
|
Q1 2014
|
Depreciation & amortization
|
175
|
199
|
205
|
Net payment for Capital expenditures
|
(89)
|
(108)
|
(112)
|
Dividends paid to stockholders
|
(82)
|
(90)
|
(85)
|
Change in inventories, net
|
18
|
(30)
|
6
|
Q1 2015
(US$ millions and cents per share)
|
Gross Profit
|
Operating Income (loss)
|
Net Earnings
|
Corresponding EPS
|
U.S. GAAP
|
566
|
(19)
|
(22)
|
(0.03)
|
Impairment & Restructuring
|
29
|
29
|
||
Estimated Income Tax Effect
|
(1)
|
|||
Non-U.S GAAP
|
566
|
10
|
6
|
0.01
|
Q4 2014
(US$ millions and cents per share)
|
Gross Profit
|
Operating Income (loss)
|
Net Earnings
|
Corresponding EPS
|
U.S. GAAP
|
619
|
38
|
43
|
0.05
|
Impairment & Restructuring
|
20
|
20
|
||
Estimated Income Tax Effect
|
(2)
|
|||
Non-U.S GAAP
|
619
|
58
|
61
|
0.07
|
Q1 2014
(US$ millions and cents per share)
|
Gross Profit
|
Operating Income (loss)
|
Net Earnings
|
Corresponding EPS
|
U.S. GAAP
|
599
|
(4)
|
(24)
|
(0.03)
|
Impairment & Restructuring
|
12
|
12
|
||
Estimated Income Tax Effect
|
(1)
|
|||
Non-U.S GAAP
|
599
|
8
|
(13)
|
(0.01)
|
Net Financial Position (in US$ millions)
|
March 28, 2015
|
December 31, 2014
|
March 29, 2014
|
Cash and cash equivalents
|
1,949
|
2,017
|
1,744
|
Marketable securities
|
338
|
334
|
-
|
Short-term deposits
|
-
|
-
|
1
|
Total financial resources
|
2,287
|
2,351
|
1,745
|
Short-term debt
|
(200)
|
(202)
|
(225)
|
Long-term debt
|
(1,575)
|
(1,599)
|
(908)
|
Total financial debt
|
(1,775)
|
(1,801)
|
(1,133)
|
Net financial position
|
512
|
550
|
612
|
Free cash flow (in US$ millions)
|
Q1 2015
|
Q4 2014
|
Q1 2014
|
Net cash from operating activities
|
149
|
311
|
53
|
Net cash used in investing activities
|
(108)
|
(103)
|
(39)
|
Proceeds from sale of marketable securities and net cash variation for joint ventures deconsolidation
|
-
|
-
|
(65)
|
Free cash flow
|
41
|
208
|
(51)
|
STMicroelectronics N.V.
|
||
Date: April 30, 2015
|
By:
|
/s/ Carlo Ferro
|
Name:
|
Carlo Ferro
|
|
Title:
|
Chief Financial Officer
Executive Vice President
Finance, Legal, Infrastructure and Services
|