In
Million US$ and %
|
Q1
2009
|
Q4
2008
|
Q1
2008
|
Net
Revenues
|
1,660
|
2,276
|
2,478
|
Gross
Margin
|
26.3%
|
36.1%
|
36.3%
|
Net
Income (Loss) per share
|
(0.62)
|
(0.42)
|
(0.09)
|
Adjusted
Earnings per share excluding impairment, restructuring and
other-than-temporary-impairment charges and purchase accounting
adjustments(*)
|
(0.31)
|
(0.06)
|
0.13
|
Net
Revenues By Market Segment / Channel
(In
%)
|
Q1
2009
|
Q4
2008
|
Q1
2008
ex
FMG
|
Market
Segment / Channel:
|
|||
Automotive
|
12%
|
12%
|
15%
|
Computer
|
11%
|
11%
|
12%
|
Consumer
|
14%
|
14%
|
14%
|
Industrial
& Other
|
8%
|
9%
|
8%
|
Telecom
(a)
|
43%
|
35%
|
32%
|
Total
OEM
|
88%
|
81%
|
81%
|
Distribution
|
12%
|
19%
|
19%
|
Operating
Segment
(In
Million US$ and %)
|
Q12009
Net
Revenues
|
Q1
2009
Operating
Income
(Loss)
|
Q4
2008
Net
Revenues
|
Q4
2008
Operating
Income
(Loss)
|
Q1
2008
Net
Revenues
|
Q1
2008
Operating
Income
(Loss)
ex
FMG
|
ACCI
|
627
|
(35)
|
899
|
18
|
1,045
|
25
|
IMS
|
499
|
12
|
791
|
101
|
772
|
95
|
Wireless (a)(b)
|
518
|
(107)
|
575
|
(77)
|
348
|
(10)
|
Others (c)(d)
|
16
|
(263)
|
11
|
(181)
|
14
|
(214)
|
|
·
|
Approval
of the Company's 2008 accounts reported in accordance with International
Financial Reporting Standards
(IFRS);
|
|
·
|
The
reappointment for a three-year term, expiring at the 2012 Annual General
Meeting, for the following members of the Supervisory Board: Mr. Doug Dunn
and Mr. Didier Lamouche; and
|
|
·
|
The
distribution of a cash dividend of US$0.12 per share, to be paid in four
equal quarterly installments in May, August and November 2009 and February
2010 to shareholders of record in the month of each quarterly payment. If
approved, for the first installment, the Company's common shares will
trade ex-dividend on Euronext Paris and the Milan Stock Exchange (Borsa
Italiana), on Monday, May 25, 2009, and the payment date will be Thursday,
May 28, 2009. For holders of shares listed on the New York
Stock Exchange, shares will trade ex-dividend on Friday, May 22, 2009, the
record date will be Wednesday, May 27, 2009, and the payment date will be
on or after Tuesday, June 2, 2009. Transfers between New York
and European (Dutch) registered shares will be closed from the end of
business in Europe on Friday, May 22, 2009, until the open of business in
New York on Thursday, May 28, 2009.
|
|
·
|
In
automotive powertrain and safety applications, ST expanded its market
share for 32-bit microcontrollers (MCUs) based on the PowerPC architecture
with significant design wins for next-generation products, including: an
airbag platform from a major European player for use by car makers in
Europe and the US; an airbag platform from a tier-one Japanese customer
targeting the mid- to low-end market in China; and an ABS platform from
another Japanese tier-one OEM. In addition, ST is also to supply smart
power products for these design
wins.
|
|
·
|
In
car-body applications, ST gained an important design win from a major
Korean OEM for a smart junction-box application for devices including
application-specific automotive ICs, 8-bit STM8A MCUs and VIPower™ chips.
ST also gained a design win for a new generation of actuator ICs for
controlling door locks, electric windows and mirrors, from a leading
European car maker, in addition to multiple wins for its STM8A MCU in
various applications in many new car
platforms.
|
|
·
|
In
car radios and multimedia, ST’s next-generation digital audio and
connectivity processor has been selected by two major European car radio
makers for their Model Year 2012 platforms. Additionally, ST’s GPS
technology was selected by a major system maker for telematics
applications in South America. ST also received orders for its Cartesio
automotive application processor from a major European OEM for a
telematics box to be used by a European car
maker.
|
|
·
|
In
consumer applications, ST introduced two single-chip set-top-box (STB)
ICs, the STi5197 for cable STBs and STi5189 for satellite STBs. The chips
enable efficient development and fast time-to-market for products such as
basic zappers, interactive and Digital Video Recorder (DVR) capable STBs,
and hybrid STBs. ST also announced its energy-saving STB architecture,
which has already been implemented in several of the company’s
leading-edge STB decoders.
|
|
·
|
Additionally,
ST also received two important product certifications: the STV0498 STB IC
has been certified by CableLabs Europe, allowing deployment in interactive
STBs for cable TV networks; and ST gained an industry first with
certification for the latest revision of the DisplayPort Compliance
standard for two products, including the recently announced STDP3100
DisplayPort-to-VGA converter.
|
|
·
|
In
consumer audio, ST began shipments of three new Sound Terminal
products embedding ST’s proprietary FFX digital amplification technology
to world-leading makers of home audio systems and LCD
TVs.
|
|
·
|
In
imaging, ST introduced the market’s first quarter-inch optical-format,
3-megapixel sensors with Extended-Depth-of-Field (EDoF) capabilities.
Enabling camera modules as small as 6.5 x 6.5mm, the sensors combine
high-quality images with size and cost benefits, offering an alternative
to auto-focus camera solutions.
|
|
·
|
In
computer peripherals, ST gained a design win for a next-generation motor
controller IC, using the company’s proprietary BCD process, from a leading
hard-disk-drive maker for enterprise
applications.
|
|
·
|
In
communications infrastructure applications, ST gained a design win for
ASICs that will be used by a world-leading manufacturer in its
enterprise-switching networking
products.
|
|
·
|
In
32-bit microcontrollers, ST added another new line to its breakthrough
32-bit STM32 ARM Cortex-M3 based MCU family. The STM32 Connectivity Line
offers high-performance variants with Ethernet, CAN and full-speed USB
On-The-Go interfaces. ST also introduced the STM32 Primer2 prototyping
tool, which adds a rich range of features for embedded
design.
|
|
·
|
In
8-bit MCUs, ST announced the general availability of the robust and
reliable STM8S105 and STM8S207 for industrial and consumer applications.
Additionally, ST unveiled its open-source capacitive touch-sensing
software library for its 8-bit STM8 MCU platform to enable easy
implementation of touch-sensitive
controls.
|
|
·
|
In
MEMS (Micro Electro-Mechanical Systems), ST announced that its 3-axis
accelerometer technology is providing motion-sensing functions in
Openmoko’s Neo Freerunner Linux-based mobile open platform. Also, ST
expanded its portfolio of ultra-compact high-performance MEMS sensors with
a 3-axis accelerometer, with absolute analog output, which is ideal for
motion-sensing applications in space- and cost-constrained
battery-operated devices. ST also gained design wins for its
motion-sensing technology from a major US laptop maker and in many
consumer and communications applications from customers in China and
Taiwan.
|
|
·
|
In
power discretes, ST announced a performance breakthrough for power MOSFETs
by achieving the best on-resistance per die area with its MDmesh™ V
technology. ST also introduced a series of 30V power transistors, based on
its STripFET™ VI DeepGATE™ process, achieving an increase in energy
efficiency in applications such as computers and telecom and networking
equipment. ST also gained numerous power MOSFET design wins, largely in
LCD TV applications, in particular from a major Korean TV maker, but also
with leading automotive and computer
customers.
|
|
·
|
In
protection devices, ST introduced various innovative ultra-low-capacitance
ESD (electro-static discharge) protection and signal-booster devices
dedicated to HDMI transmitters, mobile phones, digital cameras and PVRs
(Personal Video Recorders). In the power management area, ST gained market
success with avalanche-rated Power Schottky devices for adapters and
desktop power supplies. And in power conversion, ST gained design wins for
voltage regulator and power-controller devices in computer and
industrial-lighting applications.
|
|
·
|
In
advanced analog, ST gained design wins in temperature sensors and smart
reset ICs and also sampled clock-distribution ICs to numerous
world-leading mobile phone makers. In analog linear ICs, ST launched new
devices including: a two-channel 2.8W class-D stereo audio amplifier IC
featuring 3D effects to improve sound in portable equipment; a new
broadband signal amplifier IC for multimedia networking applications; and
a single-chip video filter/buffer for consumer products. ST also achieved
multiple design wins for linear devices with world-leading consumer and
mobile phone makers.
|
|
·
|
ST
entered into a strategic cooperation with Paratek to supply
radio-frequency (RF) tunable products for mobile phones using STs’ IPAD
(Integrated Passives and Active Devices) technology. The two companies
will advance the next generation of Paratek’s ParaScan materials
technology for high-volume manufacturing, and will develop RF tunable
products to improve ‘total radiated power’ for mobile phones, leading to
longer battery life and fewer dropped
calls.
|
|
·
|
On
February 12, 2009, ST-Ericsson was formally launched revealing its name,
management team and positioning.
|
|
·
|
In
February, the company announced its cooperation with Nokia to provide a
next-generation smart phone platform for Symbian Foundation, with a
reference platform based on ST-Ericsson’s U8500 single
chip.
|
|
·
|
Also
in February the company announced its collaboration with ARM to
demonstrate the world’s first Symmetric Multi Processing mobile platform
technology running on Symbian OS.
|
|
·
|
In
March, the company launched fully integrated single-chip solutions for
feature-rich, low-cost handsets. ST-Ericsson’s 4910 and 4908 EDGE
platforms combine the industry’s highest level of integration and
cost-efficiency, with both digital and analog basebands, RF transceiver
and power management unit (PMU) in a single
chip.
|
|
·
|
A
next-generation mobile audio digital-to-analog converter (DAC) for the
mobile music market was also launched. ST-Ericsson’s STw5211 further
extends the company’s wide portfolio of audio solutions with enhanced
performance.
|
|
·
|
Effect of the current economic
downturn on demand in the key application markets and from key
customers served by our products, and changes in customer order patterns,
including order cancellations, all of which generate uncertainties
and make it extremely difficult to accurately forecast and plan
our future business
activities;
|
|
·
|
our ability to adequately
utilize and operate our manufacturing facilities at sufficient levels to
cover fixed operating costs particularly at a time of decreasing demand
for our products as well as the financial impact of obsolete or
excess inventories if actual demand differs from our
anticipations;
|
|
·
|
the impact of intellectual
property claims by our competitors or other third parties, and our ability
to obtain required licenses on reasonable terms and
conditions;
|
|
·
|
the outcome of ongoing
litigation as well as any new litigation to which we may become a
defendant;
|
|
·
|
our ability to successfully
integrate the acquisitions we pursue, in particular the merger of ST-NXP
Wireless with Ericsson Mobile Platforms (“EMP”) to form ST-Ericsson in the
current difficult economic
environment;
|
|
·
|
we hold significant
non-marketable equity investments in Numonyx , our joint venture in the
flash memory market segment, and in ST-Ericsson, our joint venture in the
wireless segment. Additionally, we are a guarantor for certain Numonyx
debts. Therefore, declines in these market segments could result in
significant impairment charges, restructuring charges and gains/losses on
equity investments;
|
|
·
|
our ability to manage in an
intensely competitive and cyclical industry, where a high percentage of
our costs are fixed and are incurred in currencies other than U.S. dollars
as well as our ability to execute our restructuring initiatives in
accordance with our plans if unforeseen events require adjustments or
delays in implementation;
|
|
·
|
our ability in an intensively
competitive environment to secure customer acceptance and to achieve our
pricing expectations for high-volume supplies of new products in whose
development we have been, or are currently,
investing;
|
|
·
|
the ability to maintain solid,
viable relationships with our suppliers and customers in the event they
are unable to maintain a competitive market presence due, in particular,
to the effects of the current economic
environment;
|
|
·
|
changes in the political,
social or economic environment, including as a result of military
conflict, social unrest and/or terrorist activities ,economic
turmoil as well as natural events such as severe weather,
health risks, epidemics or earthquakes in the countries in which we, our
key customers or our suppliers, operate;
and
|
|
·
|
changes in our overall tax
position as a result of changes in tax laws or the outcome of tax audits,
and our ability to accurately estimate tax credits, benefits, deductions
and provisions and to realize deferred tax
assets.
|
Q1
2009
|
Gross
Profit
|
Operating
Income
|
Net
Earnings
|
Corresponding
EPS
|
U.S.
GAAP
|
437
|
(393)
|
(541)
|
(0.62)
|
Impairment
& Restructuring
|
56
|
56
|
||
Other-Than-Temporary-Impairment
|
58
|
|||
Numonyx
Impairment
|
200
|
|||
Estimated
Income Tax Effect
|
(40)
|
|||
Non-U.S
GAAP
|
437
|
(337)
|
(267)
|
(0.31)
|
Q4
2008
|
Gross
Profit
|
Operating
Income
|
Net
Earnings
|
Corresponding
EPS
|
U.S.
GAAP
|
822
|
(139)
|
(366)
|
(0.42)
|
NXP
Wireless Inventory Step-Up
|
31
|
31
|
31
|
|
Impairment
& Restructuring
|
91
|
91
|
||
Other-Than-Temporary-Impairment
|
55
|
|||
Numonyx
Impairment
|
180
|
|||
Estimated
Income Tax Effect
|
(48)
|
|||
Non-U.S
GAAP
|
853
|
(17)
|
(57)
|
(0.06)
|
Q1
2008
|
Gross
Profit
|
Operating
Income
|
Net
Earnings
|
Corresponding
EPS
|
U.S.
GAAP
|
899
|
(88)
|
(84)
|
(0.09)
|
Genesis
In-Process R&D
|
21
|
21
|
||
Impairment
& Restructuring
|
183
|
183
|
||
Other-Than-Temporary-Impairment
|
29
|
|||
Estimated
Income Tax Effect
|
(33)
|
|||
Non-U.S
GAAP
|
899
|
116
|
116
|
0.13
|
Net
Operating Cash Flow (US$ and in millions)
|
Q4
2008
|
Q1
2008
|
Net
cash from operating activities
|
390
|
502
|
Net
cash used in investing activities
|
-172
|
-453
|
Proceeds
from sale of marketable securities
|
-64
|
0
|
Net
operating cash flow
|
154
|
49
|
Net
operating cash flow (ex M&A)
|
161
|
219
|
Net
Financial Position (US$ and in millions)
|
Q1
2009
|
Q4
2008
|
Q1
2008
|
Cash
and cash equivalents
|
1,480
|
1,009
|
2,060
|
Marketable
securities, current
|
988
|
651
|
1,060
|
Restricted
cash
|
250
|
250
|
250
|
Marketable
securities, non-current
|
184
|
242
|
339
|
Total
cash position
|
2,902
|
2,152
|
3,709
|
Bank
overdrafts
|
-3
|
-20
|
0
|
Current
portion of long-term debt
|
-159
|
-123
|
-300
|
Long-term
debt
|
-2,486
|
-2,554
|
-2,324
|
Total
financial debt
|
-2,648
|
-2,697
|
-2,624
|
Net
financial position
|
254
|
-545
|
1,085
|
STMicroelectronics
N.V.
|
||||||||
Consolidated
Statements of Income
|
||||||||
(in million of
U.S. dollars, except per share data ($))
|
||||||||
Three Months
Ended
|
||||||||
(Unaudited)
|
(Unaudited)
|
|||||||
March
28,
|
March
30,
|
|||||||
2009
|
2008
|
|||||||
Net
sales
|
1,657 | 2,461 | ||||||
Other
revenues
|
3 | 17 | ||||||
NET
REVENUES
|
1,660 | 2,478 | ||||||
Cost of
sales
|
-1,223 | -1,579 | ||||||
GROSS
PROFIT
|
437 | 899 | ||||||
Selling,
general and administrative
|
-280 | -304 | ||||||
Research and
development
|
-557 | -509 | ||||||
Other income
and expenses, net
|
63 | 9 | ||||||
Impairment,
restructuring charges and other related closure
costs
|
-56 | -183 | ||||||
Total
Operating Expenses
|
-830 | -987 | ||||||
OPERATING
LOSS
|
-393 | -88 | ||||||
Oher-than-temporary
impairment charge on financial assets
|
-58 | -29 | ||||||
Interest
income, net
|
1 | 20 | ||||||
Earnings
(loss) on equity investments
|
-232 | 0 | ||||||
Loss on sale
of financial assets
|
-8 | 0 | ||||||
LOSS
BEFORE INCOME TAXES
|
-690 | -97 | ||||||
AND
NONCONTROLLING INTEREST
|
||||||||
Income tax
benefit
|
95 | 14 | ||||||
LOSS
BEFORE NONCONTROLLING INTEREST
|
-595 | -83 | ||||||
Net loss
(income) attributable to noncontrolling
interest
|
54 | -1 | ||||||
NET
LOSS ATTRIBUTABLE TO PARENT COMPANY
|
-541 | -84 | ||||||
LOSS
PER SHARE (BASIC) ATTRIBUTABLE TO PARENT COMPANY
SHAREHOLDERS
|
-0.62 | -0.09 | ||||||
LOSS
PER SHARE (DILUTED) ATTRIBUTABLE TO PARENT COMPANY
SHAREHOLDERS
|
-0.62 | -0.09 | ||||||
NUMBER
OF WEIGHTED AVERAGE
|
||||||||
SHARES
USED IN CALCULATING
|
874.3 | 899.8 | ||||||
DILUTED
LOSS PER SHARE
|
STMicroelectronics
N.V.
|
|||||||||
CONSOLIDATED
BALANCE SHEETS
|
|||||||||
As
at
|
March
28,
|
December
31,
|
March
30,
|
||||||
In
million of U.S. dollars
|
2009
|
2008
|
2008
|
||||||
(Unaudited)
|
(Audited)
|
(Unaudited)
|
|||||||
ASSETS
|
|||||||||
Current
assets:
|
|||||||||
Cash
and cash equivalents
|
1,480
|
1,009
|
2,060
|
||||||
Marketable
securities
|
988
|
651
|
1,060
|
||||||
Trade
accounts receivable, net
|
1,101
|
1,064
|
1,546
|
||||||
Inventories,
net
|
1,656
|
1,840
|
1,539
|
||||||
Deferred
tax assets
|
248
|
252
|
230
|
||||||
Receivables
for transactions performed on behalf, net
|
11
|
0
|
0
|
||||||
Other
receivables and assets
|
885
|
685
|
626
|
||||||
Total
current assets
|
6,369
|
5,501
|
7,061
|
||||||
Goodwill
|
1,138
|
958
|
314
|
||||||
Other
intangible assets, net
|
894
|
863
|
317
|
||||||
Property,
plant and equipment, net
|
4,341
|
4,739
|
5,391
|
||||||
Long-term
deferred tax assets
|
319
|
373
|
270
|
||||||
Equity
investments
|
380
|
510
|
1,035
|
||||||
Restricted
cash
|
250
|
250
|
250
|
||||||
Non-current
marketable securities
|
184
|
242
|
339
|
||||||
Other
investments and other non-current assets
|
333
|
477
|
357
|
||||||
7,839
|
8,412
|
8,273
|
|||||||
Total
assets
|
14,208
|
13,913
|
15,334
|
||||||
LIABILITIES
AND SHAREHOLDERS' EQUITY
|
|||||||||
Current
liabilities:
|
|||||||||
Bank
overdrafts
|
3
|
20
|
0
|
||||||
Current
portion of long-term debt
|
159
|
123
|
300
|
||||||
Trade
accounts payable
|
707
|
847
|
1,114
|
||||||
Other
payables and accrued liabilities
|
1,054
|
996
|
912
|
||||||
Dividends
payable to shareholders
|
0
|
79
|
0
|
||||||
Deferred
tax liabilities
|
30
|
28
|
13
|
||||||
Accrued
income tax
|
121
|
125
|
139
|
||||||
Total
current liabilities
|
2,074
|
2,218
|
2,478
|
||||||
Long-term
debt
|
2,486
|
2,554
|
2,324
|
||||||
Reserve
for pension and termination indemnities
|
313
|
332
|
302
|
||||||
Long-term
deferred tax liabilities
|
26
|
27
|
32
|
||||||
Other
non-current liabilities
|
355
|
350
|
306
|
||||||
3,180
|
3,263
|
2,964
|
|||||||
Total
liabilities
|
5,254
|
5,481
|
5,442
|
||||||
Commitment
and contingencies
|
|||||||||
Equity
|
|||||||||
Parent
company shareholders' equity
|
|||||||||
Common
stock (preferred
stock: 540,000,000 shares authorized, not issued;
|
1,156
|
1,156
|
1,156
|
||||||
common
stock: Euro 1.04 nominal value, 1,200,000,000 shares authorized,
910,307,305 shares
|
|||||||||
issued,
874,327,774 shares
outstanding)
|
|||||||||
Capital
surplus
|
2,455
|
2,324
|
2,131
|
||||||
Accumulated
result
|
3,521
|
4,064
|
5,190
|
||||||
Accumulated
other comprehensive income
|
915
|
1,094
|
1,635
|
||||||
Treasury
stock
|
-480
|
-482
|
-274
|
||||||
Total
parent company shareholders' equity
|
7,567
|
8,156
|
9,838
|
||||||
Non-controlling
interest
|
1,387
|
276
|
54
|
||||||
Total
equity
|
8,954
|
8,432
|
9,892
|
||||||
Total
liabilities and equity
|
14,208
|
13,913
|
15,334
|
||||||
STMicroelectronics N.V. | ||||
Date: April 30, 2009 | By: | /s/ CARLO FERRO | ||
Name: |
Carlo
Ferro
|
|||
Title: | Executive Vice President and Chief Financial Officer |